Wafer bonding techniques for hybrid silicon photonic devices based on surface modifications

Vlada Artel*, Tali Ilovitsh, Idan Bakish, Moran Shubely, Eyal Shekel, Yossef Ben-Ezra, Chaim N. Sukenik, Avi Zadok

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

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Engineering & Materials Science

Chemistry