Velocity dependent crack deflection in single crystal silicon

Dov Sherman*, Ilan Be'ery

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

When a 〈001〉 single crystal silicon specimen is fractured under bending at low strain energy and velocity, it prefers to cleave along the vertical {1 1 0} plane. When the same specimen is fractured under the same conditions but at higher strain energy and velocity, it cleaves on the inclined {1 1 1} plane. We analyze this phenomenon, and suggest that the cause of this phenomenon is the anisotropic velocity dependent fracture energy.

Original languageEnglish
Pages (from-to)551-555
Number of pages5
JournalScripta Materialia
Volume49
Issue number6
DOIs
StatePublished - Sep 2003
Externally publishedYes

Keywords

  • Cleavage planes
  • Crack deflection
  • Dynamic crack
  • Single crystal

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