Velocity dependent crack deflection in single crystal silicon

Dov Sherman; Ilan Be'ery

doi:10.1016/S1359-6462(03)00354-3

Velocity dependent crack deflection in single crystal silicon

Dov Sherman^*, Ilan Be'ery

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

Abstract

When a 〈001〉 single crystal silicon specimen is fractured under bending at low strain energy and velocity, it prefers to cleave along the vertical {1 1 0} plane. When the same specimen is fractured under the same conditions but at higher strain energy and velocity, it cleaves on the inclined {1 1 1} plane. We analyze this phenomenon, and suggest that the cause of this phenomenon is the anisotropic velocity dependent fracture energy.

Original language	English
Pages (from-to)	551-555
Number of pages	5
Journal	Scripta Materialia
Volume	49
Issue number	6
DOIs	https://doi.org/10.1016/S1359-6462(03)00354-3
State	Published - Sep 2003
Externally published	Yes

Keywords

Cleavage planes
Crack deflection
Dynamic crack
Single crystal

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10.1016/S1359-6462(03)00354-3

Cite this

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title = "Velocity dependent crack deflection in single crystal silicon",

abstract = "When a 〈001〉 single crystal silicon specimen is fractured under bending at low strain energy and velocity, it prefers to cleave along the vertical {1 1 0} plane. When the same specimen is fractured under the same conditions but at higher strain energy and velocity, it cleaves on the inclined {1 1 1} plane. We analyze this phenomenon, and suggest that the cause of this phenomenon is the anisotropic velocity dependent fracture energy.",

keywords = "Cleavage planes, Crack deflection, Dynamic crack, Single crystal",

author = "Dov Sherman and Ilan Be'ery",

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T1 - Velocity dependent crack deflection in single crystal silicon

AU - Sherman, Dov

AU - Be'ery, Ilan

PY - 2003/9

Y1 - 2003/9

N2 - When a 〈001〉 single crystal silicon specimen is fractured under bending at low strain energy and velocity, it prefers to cleave along the vertical {1 1 0} plane. When the same specimen is fractured under the same conditions but at higher strain energy and velocity, it cleaves on the inclined {1 1 1} plane. We analyze this phenomenon, and suggest that the cause of this phenomenon is the anisotropic velocity dependent fracture energy.

AB - When a 〈001〉 single crystal silicon specimen is fractured under bending at low strain energy and velocity, it prefers to cleave along the vertical {1 1 0} plane. When the same specimen is fractured under the same conditions but at higher strain energy and velocity, it cleaves on the inclined {1 1 1} plane. We analyze this phenomenon, and suggest that the cause of this phenomenon is the anisotropic velocity dependent fracture energy.

KW - Cleavage planes

KW - Crack deflection

KW - Dynamic crack

KW - Single crystal

UR - http://www.scopus.com/inward/record.url?scp=0038789064&partnerID=8YFLogxK

U2 - 10.1016/S1359-6462(03)00354-3

DO - 10.1016/S1359-6462(03)00354-3

M3 - מאמר

AN - SCOPUS:0038789064

VL - 49

SP - 551

EP - 555

JO - Scripta Materialia

JF - Scripta Materialia

SN - 1359-6462

IS - 6

ER -

Velocity dependent crack deflection in single crystal silicon

Abstract

Keywords

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