Vacuum arc deposition using refractory electrodes

I. I. Beilis, Y. Koulik, E. Yankelevich, D. Arbilly, R. L. Boxman

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Refractory metal plasma generated by a vacuum arc was used to deposit thin films. The deposition rate Vdep was measured for different electrode configurations: (1) a planar Zr cathode and a planar W anode-both 60mm diam, (2) 32 mm diam cylindrical W or Mo electrode pairs, and a (3) Nb cylindrical cathode (32 mm diam) closed by a BN plate and a 50 mm diam W shower-head cup anode with either (a) an array of 1 mm diameter exit holes or (b) one 4 mm diam hole Ta cup anode. For Zr films, Vdep was 0.8 μm/min at a distance 110 mm from the electrode axis at 90 s after arc ignition. For W films at 60 s after ignition and the planar electrode configuration, Vdep was 0.6 μm/min at a distance of 60 mm from the electrode axis. For Nb films deposited with the closed electrode configuration, Vdep was 0.3 μm/min at distance 80 mm from the front shower anode surface at 30 s after arc ignition. For cylindrical Mo electrode pair Vdep was about 0.4 μm/min at a distance of 110 mm, 70 s after 200 A arc ignition.

Original languageEnglish
Title of host publicationISDEIV 2014 - Proceedings of the 26th International Symposium on Discharges and Electrical Insulation in Vacuum
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages513-516
Number of pages4
ISBN (Electronic)9781479967506
DOIs
StatePublished - 18 Nov 2014
Event26th International Symposium on Discharges and Electrical Insulation in Vacuum, ISDEIV 2014 - Mumbai, India
Duration: 28 Sep 20143 Oct 2014

Publication series

NameProceedings - International Symposium on Discharges and Electrical Insulation in Vacuum, ISDEIV
ISSN (Print)1093-2941

Conference

Conference26th International Symposium on Discharges and Electrical Insulation in Vacuum, ISDEIV 2014
Country/TerritoryIndia
CityMumbai
Period28/09/143/10/14

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