ULSI copper and silver interconnect microstructure based image enhancement algorithm

H. Duadi; Pavel Livshits; E. Gur; A. Inberg; Y. Shacham-Diamand; A. Weiss; Z. Zalevsky

ULSI copper and silver interconnect microstructure based image enhancement algorithm

H. Duadi, Pavel Livshits^*, E. Gur, A. Inberg, Y. Shacham-Diamand, A. Weiss, Z. Zalevsky

^*Corresponding author for this work

School of Electrical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Original language	English
Title of host publication	Advanced Metallization Conference 2010
Pages	13-14
Number of pages	2
State	Published - 2010
Event	Advanced Metallization Conference 2010 - Albany, NY, United States Duration: 5 Oct 2010 → 7 Oct 2010

Publication series

Name	Advanced Metallization Conference (AMC)
ISSN (Print)	1540-1766

Conference

Conference	Advanced Metallization Conference 2010
Country/Territory	United States
City	Albany, NY
Period	5/10/10 → 7/10/10

Cite this

@inproceedings{7adb2e6a4f0b453fba2f9d4e019c556e,

title = "ULSI copper and silver interconnect microstructure based image enhancement algorithm",

author = "H. Duadi and Pavel Livshits and E. Gur and A. Inberg and Y. Shacham-Diamand and A. Weiss and Z. Zalevsky",

year = "2010",

language = "אנגלית",

isbn = "9781617822810",

series = "Advanced Metallization Conference (AMC)",

pages = "13--14",

booktitle = "Advanced Metallization Conference 2010",

note = "Advanced Metallization Conference 2010 ; Conference date: 05-10-2010 Through 07-10-2010",

}

TY - GEN

T1 - ULSI copper and silver interconnect microstructure based image enhancement algorithm

AU - Duadi, H.

AU - Livshits, Pavel

AU - Gur, E.

AU - Inberg, A.

AU - Shacham-Diamand, Y.

AU - Weiss, A.

AU - Zalevsky, Z.

PY - 2010

Y1 - 2010

UR - http://www.scopus.com/inward/record.url?scp=79957651594&partnerID=8YFLogxK

M3 - ???researchoutput.researchoutputtypes.contributiontobookanthology.conference???

AN - SCOPUS:79957651594

SN - 9781617822810

T3 - Advanced Metallization Conference (AMC)

SP - 13

EP - 14

BT - Advanced Metallization Conference 2010

T2 - Advanced Metallization Conference 2010

Y2 - 5 October 2010 through 7 October 2010

ER -

ULSI copper and silver interconnect microstructure based image enhancement algorithm

Publication series

Conference

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Cite this