In recent years there has been a growing awareness of the compressive strength criticality of near-surface interlaminar defects. Delamination/compression type failure has been encountered in a variety of forms including the failure of laminated plates subjected to low-velocity impact, unwinding of laminated pipes under hydrostatic pressure and coating failure in electronic circuit boards. The purpose of this work is to develop an analytical model for this type of failure phenomenon.
|Number of pages||2|
|Journal||Developments in Mechanics|
|State||Published - 1985|