Tracking the development of structural bonding in composite repairs during curing

I. Kressel*, Y. Botsev, S. Ronen, M. Tur

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

A novel structural assessment technique for composite bonded repairs of metallic structures is introduced, using embedded fiber optic Bragg sensors. By utilizing the large difference in the thermal expansion coefficients between the composite patch and the Aluminum substrate, the tracking of both the curing process and bonding quality is now made possible for both room and elevated temperature cure adhesives.

Original languageEnglish
Title of host publicationProceedings of the 5th European Workshop - Structural Health Monitoring 2010
Pages95-99
Number of pages5
StatePublished - 2010
Event5th European Workshop on Structural Health Monitoring 2010 - Naples, Italy
Duration: 28 Jun 20104 Jul 2010

Publication series

NameProceedings of the 5th European Workshop - Structural Health Monitoring 2010

Conference

Conference5th European Workshop on Structural Health Monitoring 2010
Country/TerritoryItaly
CityNaples
Period28/06/104/07/10

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