Thin-Film Deposition with Refractory Materials Using a Vacuum Arc

Isak I. Beilis, Yosef Koulik, Yefim Yankelevich, David Arbilly, Raymond L. Boxman

Research output: Contribution to journalArticlepeer-review

Abstract

Refractory metal plasma generated by a vacuum arc was used to deposit thin films with different arc currents I. The deposition rate Vdep was measured for electrode configurations including a planar Zr cathode and a planar W anode; cylindrical W or Mo electrode pairs and a cylindrical Nb cathode closed by a BN plate and a W or Nb shower-head cup anode or with one-hole Ta cup anode. Vdep for a Mo electrode pair with I=275 A at a distance L=110 mm from the electrode axis reached 2.2 μm /min, 60 s after arc ignition. For the W electrode pair Vdep was ∼ 1μm/min at 80 s (I=200 A and L=110 mm), while for W film deposition with shower-head anode Vdep was ∼ 0.6μ m/min (I=200 A and L=60 mm). For Nb films deposited with the closed electrode configuration, Vdep was 0.3 μ m/min at 30 s after arc ignition (I=275 A and L=80 mm from the anode front).

Original languageEnglish
Article number7161380
Pages (from-to)2323-2328
Number of pages6
JournalIEEE Transactions on Plasma Science
Volume43
Issue number8
DOIs
StatePublished - 1 Aug 2015

Keywords

  • Metallic plasma
  • refractory electrode
  • thin film
  • vacuum arc

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