Keyphrases
Electroless
100%
Self-assembled Monolayer
100%
Film Growth
100%
Titanium Nitride
100%
Nitrided Layer
100%
Initial Growth
50%
Diethylenetriamine
50%
Aminopropyltrimethoxysilane
50%
Atomic Force Microscopy
25%
Electrical Properties
25%
Surface Coverage
25%
Lateral Growth
25%
High-resolution Transmission Electron Microscopy (HRTEM)
25%
Morphological Properties
25%
Au Nanoparticles (AuNPs)
25%
Silane
25%
Surface Diffusion
25%
Capping Layer
25%
Amine Group
25%
Scaling Behavior
25%
Initial nucleation
25%
Layer Growth
25%
Barrier Layer
25%
Electroless Cobalt
25%
Copper Interconnect
25%
Misfit
25%
Gold Nanoparticles(AuNPs)
25%
Surface Roughness Evolution
25%
3D Growth
25%
Cobalt Alloys
25%
Nucleation Density
25%
Micromechanical Devices
25%
Integrated Circuits
25%
Cobalt Tungsten
25%
Silane Monomer
25%
Nucleation Growth
25%
Catalytic Layer
25%
Coverage Properties
25%
Flexible Printed Circuit Board
25%
Material Science
Nitride Compound
100%
Titanium
100%
Self Assembled Monolayer
100%
Film Growth
100%
Nucleation
75%
Gold Nanoparticle
75%
Electronic Circuit
50%
Silane
50%
Density
25%
Film
25%
Surface Roughness
25%
Tungsten
25%
Surface Diffusion
25%
High-Resolution Transmission Electron Microscopy
25%
Cobalt
25%
Surface (Surface Science)
25%
Atomic Force Microscopy
25%
Cobalt Alloy
25%
Engineering
Self-Assembled Monolayers
100%
Nitride Layer
100%
Gold Nanoparticle
75%
High Resolution
25%
Atomic Force Microscopy
25%
Interconnects
25%
Nitride
25%
Monomer
25%
Surface Coverage
25%
Initial Stage
25%
Capping Layer
25%
Lateral Growth
25%
Flexible Printed Circuit Board
25%
Integrated Circuit
25%
Barrier Layer
25%
Chemical Engineering
Silane
100%
Titanium Nitride
100%
Film
100%
Nanoparticle
50%
Surface Diffusion
50%
Catalytic Layer
50%