Thermal Generalized Stress Intensity Factors in 2-D Domains

Research output: Chapter in Book/Report/Conference proceedingChapterpeer-review

Abstract

Lately, methods that are capable of predicting failure initiation and propagation in structural components subjected to thermal loads have been sought. It is postulated, as in the theory of linear elastic fracture mechanics, that the methods should correlate experimental observed failures to parameters characterizing the thermoelastic stress field in the vicinity of failure initiation points. Failures due to thermal loading occur, for example, in integrated circuits, which are assemblages of dissimilar materials with different thermal and mechanical properties (addressed in Chapter 9). The mismatch of elastic constants and thermal expansion coefficients causes stress intensification at corners of interfaces and may lead to mechanical failure.

Original languageEnglish
Title of host publicationInterdisciplinary Applied Mathematics
PublisherSpringer Nature
Pages157-183
Number of pages27
DOIs
StatePublished - 2012
Externally publishedYes

Publication series

NameInterdisciplinary Applied Mathematics
Volume37
ISSN (Print)0939-6047
ISSN (Electronic)2196-9973

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