Keyphrases
Microstructure
100%
Electrostatically Actuated
100%
Deflection
100%
Snap-through
100%
Pull-In Behavior
100%
Scanning Electron Microscopy
50%
Electrostatic Force
50%
Numerical Analysis
50%
Deep Reactive Ion Etching
50%
Closed-form Approximation
50%
Bistability
50%
Pull-in Instability
50%
Critical Voltage
50%
Electrostatic Nonlinearity
50%
Galerkin
50%
Lumped Model
50%
Order Reduction
50%
Silicon-on-insulator Wafer
50%
Initial Elevation
50%
Straight Beam
50%
Mechanical Nonlinearity
50%
Euler-Bernoulli
50%
Clamped-clamped Microbeam
50%
Actual Dimension
50%
Deflection Characteristics
50%
In-plane Response
50%
Engineering
Electrostatics
100%
Microstructure
100%
Bistables
100%
Snap-Through
100%
Good Agreement
50%
Experimental Investigation
50%
Closed Form
50%
Shallower
50%
Nonlinearity
50%
Deep Reactive Ion Etching
50%
Buckling
50%
Silicon on Insulator
50%
Theoretical Investigation
50%
Critical Voltage
50%
Deflection Characteristic
50%
Material Science
Snap-Through
100%
Silicon
50%
Scanning Electron Microscopy
50%
Reactive Ion Etching
50%