The evolution and analysis of electrical percolation threshold in nanometer scale thin seed layer deposited by electroless plating

V. Sabayev, N. Croitoru, A. Inberg, Y. Shacham-Diamand

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Original languageEnglish
Title of host publicationAdvanced Metallization Conference 2010
Pages25-26
Number of pages2
StatePublished - 2010
EventAdvanced Metallization Conference 2010 - Albany, NY, United States
Duration: 5 Oct 20107 Oct 2010

Publication series

NameAdvanced Metallization Conference (AMC)
ISSN (Print)1540-1766

Conference

ConferenceAdvanced Metallization Conference 2010
Country/TerritoryUnited States
CityAlbany, NY
Period5/10/107/10/10

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