The electrodeposition of cobalt-nickel-iron high aspect ratio thick film structures for magnetic MEMS applications

Yelena Sverdlov; Yuri Rosenberg; Yu I. Rozenberg; Ron Zmood; Raviv Erlich; Sivan Natan; Yosi Shacham-Diamand

doi:10.1016/j.mee.2004.07.039

The electrodeposition of cobalt-nickel-iron high aspect ratio thick film structures for magnetic MEMS applications

Yelena Sverdlov, Yuri Rosenberg, Yu I. Rozenberg^*, Ron Zmood, Raviv Erlich, Sivan Natan, Yosi Shacham-Diamand

^*Corresponding author for this work

School of Electrical Engineering

Research output: Contribution to journal › Conference article › peer-review

23 Scopus citations

Abstract

Thick (up to 100 μm) CoNiFe soft magnetic films were electrodeposited for micro-system technology application. The solid composition was characterized and compared to the bath composition and the deposition conditions. The samples obtained were either single or two-phased depending primarily on the Fe concentration; the highest attained B_s was of about 20 kG. It was shown that film resistivity of 50 μΩ cm can be reached by adding molybdenum salts to the bath. The films were deposited either on blanket wafers or on pre-defined photoresist patterned wafers. The resultant island structure was used to define small magnetic components.

Original language	English
Pages (from-to)	258-265
Number of pages	8
Journal	Microelectronic Engineering
Volume	76
Issue number	1-4
DOIs	https://doi.org/10.1016/j.mee.2004.07.039
State	Published - Oct 2004
Event	Materials for Advanced Metallization - Brussels, Belgium Duration: 7 Mar 2004 → 10 Mar 2004

Keywords

CoNiFe alloys
Electrodeposition
High B thick film

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10.1016/j.mee.2004.07.039

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@article{672183cc6db24881b30b4abda83e80da,

title = "The electrodeposition of cobalt-nickel-iron high aspect ratio thick film structures for magnetic MEMS applications",

abstract = "Thick (up to 100 μm) CoNiFe soft magnetic films were electrodeposited for micro-system technology application. The solid composition was characterized and compared to the bath composition and the deposition conditions. The samples obtained were either single or two-phased depending primarily on the Fe concentration; the highest attained Bs was of about 20 kG. It was shown that film resistivity of 50 μΩ cm can be reached by adding molybdenum salts to the bath. The films were deposited either on blanket wafers or on pre-defined photoresist patterned wafers. The resultant island structure was used to define small magnetic components.",

keywords = "CoNiFe alloys, Electrodeposition, High B thick film",

author = "Yelena Sverdlov and Yuri Rosenberg and Rozenberg, {Yu I.} and Ron Zmood and Raviv Erlich and Sivan Natan and Yosi Shacham-Diamand",

year = "2004",

month = oct,

doi = "10.1016/j.mee.2004.07.039",

language = "אנגלית",

volume = "76",

pages = "258--265",

journal = "Microelectronic Engineering",

issn = "0167-9317",

publisher = "Elsevier B.V.",

number = "1-4",

note = "Materials for Advanced Metallization ; Conference date: 07-03-2004 Through 10-03-2004",

}

TY - JOUR

T1 - The electrodeposition of cobalt-nickel-iron high aspect ratio thick film structures for magnetic MEMS applications

AU - Sverdlov, Yelena

AU - Rosenberg, Yuri

AU - Rozenberg, Yu I.

AU - Zmood, Ron

AU - Erlich, Raviv

AU - Natan, Sivan

AU - Shacham-Diamand, Yosi

PY - 2004/10

Y1 - 2004/10

N2 - Thick (up to 100 μm) CoNiFe soft magnetic films were electrodeposited for micro-system technology application. The solid composition was characterized and compared to the bath composition and the deposition conditions. The samples obtained were either single or two-phased depending primarily on the Fe concentration; the highest attained Bs was of about 20 kG. It was shown that film resistivity of 50 μΩ cm can be reached by adding molybdenum salts to the bath. The films were deposited either on blanket wafers or on pre-defined photoresist patterned wafers. The resultant island structure was used to define small magnetic components.

AB - Thick (up to 100 μm) CoNiFe soft magnetic films were electrodeposited for micro-system technology application. The solid composition was characterized and compared to the bath composition and the deposition conditions. The samples obtained were either single or two-phased depending primarily on the Fe concentration; the highest attained Bs was of about 20 kG. It was shown that film resistivity of 50 μΩ cm can be reached by adding molybdenum salts to the bath. The films were deposited either on blanket wafers or on pre-defined photoresist patterned wafers. The resultant island structure was used to define small magnetic components.

KW - CoNiFe alloys

KW - Electrodeposition

KW - High B thick film

UR - http://www.scopus.com/inward/record.url?scp=4544232434&partnerID=8YFLogxK

U2 - 10.1016/j.mee.2004.07.039

DO - 10.1016/j.mee.2004.07.039

M3 - ???researchoutput.researchoutputtypes.contributiontojournal.conferencearticle???

AN - SCOPUS:4544232434

SN - 0167-9317

VL - 76

SP - 258

EP - 265

JO - Microelectronic Engineering

JF - Microelectronic Engineering

IS - 1-4

T2 - Materials for Advanced Metallization

Y2 - 7 March 2004 through 10 March 2004

ER -

The electrodeposition of cobalt-nickel-iron high aspect ratio thick film structures for magnetic MEMS applications

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Keywords

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