The electrodeposition of cobalt-nickel-iron high aspect ratio thick film structures for magnetic MEMS applications

Yelena Sverdlov, Yuri Rosenberg, Yu I. Rozenberg, Ron Zmood, Raviv Erlich, Sivan Natan, Yosi Shacham-Diamand

Research output: Contribution to journalConference articlepeer-review

Abstract

Thick (up to 100 μm) CoNiFe soft magnetic films were electrodeposited for micro-system technology application. The solid composition was characterized and compared to the bath composition and the deposition conditions. The samples obtained were either single or two-phased depending primarily on the Fe concentration; the highest attained Bs was of about 20 kG. It was shown that film resistivity of 50 μΩ cm can be reached by adding molybdenum salts to the bath. The films were deposited either on blanket wafers or on pre-defined photoresist patterned wafers. The resultant island structure was used to define small magnetic components.

Original languageEnglish
Pages (from-to)258-265
Number of pages8
JournalMicroelectronic Engineering
Volume76
Issue number1-4
DOIs
StatePublished - Oct 2004
EventMaterials for Advanced Metallization - Brussels, Belgium
Duration: 7 Mar 200410 Mar 2004

Keywords

  • CoNiFe alloys
  • Electrodeposition
  • High B thick film

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