Keyphrases
Boron
100%
Barrier Properties
100%
Tungsten
100%
Electroless Cobalt
100%
Cobalt Tungsten
100%
Oxidation Properties
100%
Cu Oxidation
100%
Boron Film
100%
Cu Barrier
100%
Barrier Layer
66%
Cobalt
50%
Capping Layer
50%
CoWB
33%
Alkali Ions
33%
High Density
16%
One Sample
16%
Possible Mechanisms
16%
Resistivity
16%
Citrate
16%
Liner
16%
Morphological Structure
16%
Reducing Agent
16%
Single Bath
16%
Electroplating Bath
16%
Nickel Film
16%
Film Properties
16%
Electroless Nickel
16%
Cobalt Film
16%
Copper Metallization
16%
Oxidation Resistance
16%
Integrated Circuits
16%
Enhanced Diffusion
16%
Occurrence Mechanism
16%
Boron Layer
16%
Aminoboranes
16%
Circuit Application
16%
Cu Corrosion
16%
Material Barrier
16%
Barrier Resistance
16%
Interlayer Properties
16%
Oxidation Protection
16%
Material Science
Film
100%
Oxidation Reaction
100%
Tungsten
100%
Boron
100%
Cobalt
100%
Density
12%
Electrical Resistivity
12%
Electronic Circuit
12%
Reducing Agent
12%
Plating
12%
Corrosion
12%
Oxidation Resistance
12%
Engineering
Barrier Layer
100%
Capping Layer
75%
Metallizations
25%
Boran
25%
Free Ion
25%
Oxidation Resistance
25%
Resistance Property
25%
Integrated Circuit
25%
Bath Type
25%
Barrier Material
25%
Film Property
25%
Enhanced Diffusion
25%