TY - GEN
T1 - Tactical grade micro gyroscope with dual capcitive/optical sensing
AU - Maimon, R.
AU - Lahav, O.
AU - Gerson, Y.
AU - Zohar, O.
AU - Berko, H.
AU - Krylov, S.
PY - 2013
Y1 - 2013
N2 - This paper introduces a design, fabrication, integration and characterization, of a novel high-grade single axis tuning fork gyroscope (TFG), based on dual detection techniques - capacitive and optic (DDT-CO). This is the first time that the capacitive and optical sensing approaches are used, for the registering of the in-plane drive and in-plane sense mode responses. The two techniques are combined in the same fully functional vacuum packaged device with integrated electronics. We present the results of the rate-table performance study, and the sensor's main figures of merit. We show that the use of dual sensing significantly simplifies the silicon on insulator (SOI) fabrication process, allowing the achievement of tactical grade performance, including angular random walk (ARW) less than 0.15 °/√hr and in-run bias instability (BI) less than 2 °/hr.
AB - This paper introduces a design, fabrication, integration and characterization, of a novel high-grade single axis tuning fork gyroscope (TFG), based on dual detection techniques - capacitive and optic (DDT-CO). This is the first time that the capacitive and optical sensing approaches are used, for the registering of the in-plane drive and in-plane sense mode responses. The two techniques are combined in the same fully functional vacuum packaged device with integrated electronics. We present the results of the rate-table performance study, and the sensor's main figures of merit. We show that the use of dual sensing significantly simplifies the silicon on insulator (SOI) fabrication process, allowing the achievement of tactical grade performance, including angular random walk (ARW) less than 0.15 °/√hr and in-run bias instability (BI) less than 2 °/hr.
UR - http://www.scopus.com/inward/record.url?scp=84875431944&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2013.6474322
DO - 10.1109/MEMSYS.2013.6474322
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AN - SCOPUS:84875431944
SN - 9781467356558
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 637
EP - 640
BT - IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
T2 - IEEE 26th International Conference on Micro Electro Mechanical Systems, MEMS 2013
Y2 - 20 January 2013 through 24 January 2013
ER -