Structure of electroless deposited Co0.9W0.02P 0.08 thin films and their evolution with thermal annealing

A. Kohn; M. Eizenberg; Y. Shacham-Diamand

doi:10.1063/1.1602572

Structure of electroless deposited Co_0.9W_0.02P _0.08 thin films and their evolution with thermal annealing

A. Kohn^*, M. Eizenberg, Y. Shacham-Diamand

^*Corresponding author for this work

School of Electrical Engineering

Technion-Israel Institute of Technology

Research output: Contribution to journal › Article › peer-review

29 Scopus citations

Abstract

The structure of electroless deposited Co_0.9W _0.02P_0.08 thin films and their evolution with thermal annealing were presented. It was shown that as-deposited microstructure was comprised of an amorphous CoWP component and nanocrystallites of hexagonal-close-packed (hcp) Co, approximately 5 nm in size. The isothermal anneals showed that the rate of nucleation with time of the hcp Co grains was constant.

Original language	English
Pages (from-to)	3810-3822
Number of pages	13
Journal	Journal of Applied Physics
Volume	94
Issue number	6
DOIs	https://doi.org/10.1063/1.1602572
State	Published - 15 Sep 2003

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abstract = "The structure of electroless deposited Co0.9W 0.02P0.08 thin films and their evolution with thermal annealing were presented. It was shown that as-deposited microstructure was comprised of an amorphous CoWP component and nanocrystallites of hexagonal-close-packed (hcp) Co, approximately 5 nm in size. The isothermal anneals showed that the rate of nucleation with time of the hcp Co grains was constant.",

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AB - The structure of electroless deposited Co0.9W 0.02P0.08 thin films and their evolution with thermal annealing were presented. It was shown that as-deposited microstructure was comprised of an amorphous CoWP component and nanocrystallites of hexagonal-close-packed (hcp) Co, approximately 5 nm in size. The isothermal anneals showed that the rate of nucleation with time of the hcp Co grains was constant.

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Structure of electroless deposited Co_0.9W_0.02P _0.08 thin films and their evolution with thermal annealing

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