TY - JOUR
T1 - Soft Devices for High-Resolution Neuro-Stimulation
T2 - The Interplay Between Low-Rigidity and Resolution
AU - Vėbraitė, Ieva
AU - Hanein, Yael
N1 - Publisher Copyright:
Copyright © 2021 Vėbraitė and Hanein.
PY - 2021
Y1 - 2021
N2 - The field of neurostimulation has evolved over the last few decades from a crude, low-resolution approach to a highly sophisticated methodology entailing the use of state-of-the-art technologies. Neurostimulation has been tested for a growing number of neurological applications, demonstrating great promise and attracting growing attention in both academia and industry. Despite tremendous progress, long-term stability of the implants, their large dimensions, their rigidity and the methods of their introduction and anchoring to sensitive neural tissue remain challenging. The purpose of this review is to provide a concise introduction to the field of high-resolution neurostimulation from a technological perspective and to focus on opportunities stemming from developments in materials sciences and engineering to reduce device rigidity while optimizing electrode small dimensions. We discuss how these factors may contribute to smaller, lighter, softer and higher electrode density devices.
AB - The field of neurostimulation has evolved over the last few decades from a crude, low-resolution approach to a highly sophisticated methodology entailing the use of state-of-the-art technologies. Neurostimulation has been tested for a growing number of neurological applications, demonstrating great promise and attracting growing attention in both academia and industry. Despite tremendous progress, long-term stability of the implants, their large dimensions, their rigidity and the methods of their introduction and anchoring to sensitive neural tissue remain challenging. The purpose of this review is to provide a concise introduction to the field of high-resolution neurostimulation from a technological perspective and to focus on opportunities stemming from developments in materials sciences and engineering to reduce device rigidity while optimizing electrode small dimensions. We discuss how these factors may contribute to smaller, lighter, softer and higher electrode density devices.
KW - electrode adhesion
KW - electrode substrate
KW - multi electrode arrays
KW - neurostimulation
KW - prosthesis
UR - http://www.scopus.com/inward/record.url?scp=85133505543&partnerID=8YFLogxK
U2 - 10.3389/fmedt.2021.675744
DO - 10.3389/fmedt.2021.675744
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AN - SCOPUS:85133505543
SN - 2673-3129
VL - 3
JO - Frontiers in Medical Technology
JF - Frontiers in Medical Technology
M1 - 675744
ER -