TY - JOUR
T1 - Soft and flexible gold microelectrodes by supersonic cluster beam deposition and femtosecond laser processing
AU - Dotan, Tali
AU - Berg, Yuval
AU - Migliorini, Lorenzo
AU - Villa, Sara Moon
AU - Santaniello, Tommaso
AU - Milani, Paolo
AU - Shacham-Diamand, Yosi
N1 - Publisher Copyright:
© 2020
PY - 2021/1/15
Y1 - 2021/1/15
N2 - Soft and flexible microelectrodes are fabricated and patterned in a novel approach integrating supersonic cluster beam deposition (SCBD) of gold nanoparticles onto Polydimethylsiloxane (PDMS) followed by femtosecond (fs) laser processing. SCBD of gold nanoparticles in PDMS forms a nanocomposite film with mechanical properties similar to those of the elastomeric substrate. Electrically neutral metallic nanoparticles penetrate the polymeric matrix and distribute randomly up to a depth of a few hundred nanometers forming a path of ohmic conduction. High resolution patterning on soft substrates is a major challenge that was overcome by femtosecond laser ablation of micrometer lines with relatively very little thermal damage. Microelectrodes were fabricated with a width down to 3 μm. The printed metal line sheet resistance was 480 Ohm/square for the 100 nm thick film and 210 Ohm/square for the 200 nm thick film. The calculated average film specific resistivity was found to be 2.5–2.6mΩ·cm. It is ~3 orders of magnitude higher than that of physical vapor deposited gold; therefore, it is not suitable for high current interconnects but sufficient for low-current signal transmission such as for electrical and electrochemical biosensors.
AB - Soft and flexible microelectrodes are fabricated and patterned in a novel approach integrating supersonic cluster beam deposition (SCBD) of gold nanoparticles onto Polydimethylsiloxane (PDMS) followed by femtosecond (fs) laser processing. SCBD of gold nanoparticles in PDMS forms a nanocomposite film with mechanical properties similar to those of the elastomeric substrate. Electrically neutral metallic nanoparticles penetrate the polymeric matrix and distribute randomly up to a depth of a few hundred nanometers forming a path of ohmic conduction. High resolution patterning on soft substrates is a major challenge that was overcome by femtosecond laser ablation of micrometer lines with relatively very little thermal damage. Microelectrodes were fabricated with a width down to 3 μm. The printed metal line sheet resistance was 480 Ohm/square for the 100 nm thick film and 210 Ohm/square for the 200 nm thick film. The calculated average film specific resistivity was found to be 2.5–2.6mΩ·cm. It is ~3 orders of magnitude higher than that of physical vapor deposited gold; therefore, it is not suitable for high current interconnects but sufficient for low-current signal transmission such as for electrical and electrochemical biosensors.
KW - Femtosecond lasers
KW - Flexible electronics
KW - Microelectrodes
KW - Micropatterning
KW - Nanocomposite films
KW - Supersonic cluster beam deposition
UR - http://www.scopus.com/inward/record.url?scp=85097527771&partnerID=8YFLogxK
U2 - 10.1016/j.mee.2020.111478
DO - 10.1016/j.mee.2020.111478
M3 - ???researchoutput.researchoutputtypes.contributiontojournal.article???
AN - SCOPUS:85097527771
SN - 0167-9317
VL - 237
JO - Microelectronic Engineering
JF - Microelectronic Engineering
M1 - 111478
ER -