TY - GEN
T1 - Single layer tilting actuator with multiple close-gap electrodes
AU - Shmilovich, T.
AU - Krylov, S.
PY - 2007
Y1 - 2007
N2 - We report on the novel architecture and operational principle of a tilting electrostatic actuator fabricated using single structural layer. The actuator is fabricated using silicon on insulator (SOI) technology and incorporates comb-like high aspect ratio electrodes oriented in the direction parallel to the rotation axis of the tilting element. Tilting motion is accompanied by the decrease of the distance between the electrodes, resulting in the non-uniform distribution of electrostatic pressure and appearance of the actuation torque. A feasibility study is performed using a reduced order model of the electrostatically actuated device and verified by a coupled three-dimensional simulation. Experimental results suggest that this architecture can be efficiently used for static and resonant operation of electrostatic devices where the tilting motion is desirable.
AB - We report on the novel architecture and operational principle of a tilting electrostatic actuator fabricated using single structural layer. The actuator is fabricated using silicon on insulator (SOI) technology and incorporates comb-like high aspect ratio electrodes oriented in the direction parallel to the rotation axis of the tilting element. Tilting motion is accompanied by the decrease of the distance between the electrodes, resulting in the non-uniform distribution of electrostatic pressure and appearance of the actuation torque. A feasibility study is performed using a reduced order model of the electrostatically actuated device and verified by a coupled three-dimensional simulation. Experimental results suggest that this architecture can be efficiently used for static and resonant operation of electrostatic devices where the tilting motion is desirable.
UR - http://www.scopus.com/inward/record.url?scp=52249097185&partnerID=8YFLogxK
U2 - 10.1109/memsys.2007.4433125
DO - 10.1109/memsys.2007.4433125
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AN - SCOPUS:52249097185
SN - 1424409519
SN - 9781424409518
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 675
EP - 678
BT - Proceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007
Y2 - 21 January 2007 through 25 January 2007
ER -