Keyphrases
Electroless Deposition
100%
Metallization
100%
Two Dimensional Model
100%
CuO Thin Films
100%
Very Large Scale Integration
100%
Diffusivity
66%
Finite Element
66%
Reaction Coefficient
66%
Ballistic Deposition
66%
Order of Magnitude
33%
Silicon Oxide
33%
Technology Integration
33%
Cu(II) Ions
33%
Automatically Generate
33%
Cu(II)
33%
Submicron
33%
Nonlinear Diffusion Equation
33%
Numerical Model
33%
Copper Ions
33%
Scanning Electron Micrograph
33%
Film Surface
33%
Diffusion Equation
33%
Ionic Species
33%
Nonlinear Boundary Conditions
33%
Copper Film
33%
Electroless Copper Deposition
33%
Electroless Cu Deposition
33%
High Aspect Ratio Trenches
33%
One-dimensional numerical Model
33%
High Aspect Ratio Features
33%
Dissolved Cu
33%
Thin Film Growth
33%
Surface Reaction Kinetics
33%
Growth Simulator
33%
Diffusivity Coefficient
33%
Triangular Grid
33%
Engineering
Diffusivity
100%
Two Dimensional
100%
Metallizations
100%
Thin Films
100%
Dimensional Model
100%
VLSI Circuits
100%
Finite Element Method
66%
High Aspect Ratio
66%
One Dimensional
66%
Numerical Model
66%
Diffusion Equation
66%
Boundary Condition
33%
Experimental Result
33%
Simulators
33%
Micrograph
33%
Silicon Oxide
33%
Film Surface
33%
Thin Film Growth
33%