Simulation of electroless deposition of Cu thin films for very large scale integration metallization

Keyphrases

• Electroless Deposition 100%
• Metallization 100%
• Two Dimensional Model 100%
• CuO Thin Films 100%
• Very Large Scale Integration 100%
• Diffusivity 66%
• Finite Element 66%
• Reaction Coefficient 66%
• Ballistic Deposition 66%
• Order of Magnitude 33%
• Silicon Oxide 33%
• Technology Integration 33%
• Cu(II) Ions 33%
• Automatically Generate 33%
• Cu(II) 33%
• Submicron 33%
• Nonlinear Diffusion Equation 33%
• Numerical Model 33%
• Copper Ions 33%
• Scanning Electron Micrograph 33%
• Film Surface 33%
• Diffusion Equation 33%
• Ionic Species 33%
• Nonlinear Boundary Conditions 33%
• Copper Film 33%
• Electroless Copper Deposition 33%
• Electroless Cu Deposition 33%
• High Aspect Ratio Trenches 33%
• One-dimensional numerical Model 33%
• High Aspect Ratio Features 33%
• Dissolved Cu 33%
• Thin Film Growth 33%
• Surface Reaction Kinetics 33%
• Growth Simulator 33%
• Diffusivity Coefficient 33%
• Triangular Grid 33%

Engineering

• Diffusivity 100%
• Two Dimensional 100%
• Metallizations 100%
• Thin Films 100%
• Dimensional Model 100%
• VLSI Circuits 100%
• Finite Element Method 66%
• High Aspect Ratio 66%
• One Dimensional 66%
• Numerical Model 66%
• Diffusion Equation 66%
• Boundary Condition 33%
• Experimental Result 33%
• Simulators 33%
• Micrograph 33%
• Silicon Oxide 33%
• Film Surface 33%
• Thin Film Growth 33%