@inproceedings{56c80a03ba6c43be8ec69d4479b5ad93,
title = "RF interconnects for communications on-chip",
abstract = "In this paper, we propose a new way of implementing on-chip global interconnect that would meet stringent challenges of core-to-core communications in latency, data rate, and re-configurability for future chip-microprocessors (CMP) with efficient area and energy overheads. We discuss the limitation of traditional RC-limited interconnects and possible benefits of multi-band RF-interconnect (RF-I) through on-chip differential transmission lines. The physical implementation of RF-I and its projected performance versus overhead as the function of CMOS technology scaling are discussed as well.",
keywords = "Chip MultiProcessors, Network-on-chip, RF-interconnect",
author = "Chang, {M. C.Frank} and Eran Socher and Tam, {Sai Wang} and Jason Cong and Glenn Reinman",
year = "2008",
doi = "10.1145/1353629.1353649",
language = "אנגלית",
isbn = "9781605580487",
series = "Proceedings of the International Symposium on Physical Design",
pages = "78--83",
booktitle = "ISPD'08 - Proceedings of the 2008 ACM International Symposium on Physical Design",
note = "2008 ACM International Symposium on Physical Design, ISPD 2008 ; Conference date: 13-04-2008 Through 16-04-2008",
}