RF interconnects for communications on-chip

M. C.Frank Chang, Eran Socher, Sai Wang Tam, Jason Cong, Glenn Reinman

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review


In this paper, we propose a new way of implementing on-chip global interconnect that would meet stringent challenges of core-to-core communications in latency, data rate, and re-configurability for future chip-microprocessors (CMP) with efficient area and energy overheads. We discuss the limitation of traditional RC-limited interconnects and possible benefits of multi-band RF-interconnect (RF-I) through on-chip differential transmission lines. The physical implementation of RF-I and its projected performance versus overhead as the function of CMOS technology scaling are discussed as well.

Original languageEnglish
Title of host publicationISPD'08 - Proceedings of the 2008 ACM International Symposium on Physical Design
Number of pages6
StatePublished - 2008
Externally publishedYes
Event2008 ACM International Symposium on Physical Design, ISPD 2008 - Portland, OR, United States
Duration: 13 Apr 200816 Apr 2008

Publication series

NameProceedings of the International Symposium on Physical Design


Conference2008 ACM International Symposium on Physical Design, ISPD 2008
Country/TerritoryUnited States
CityPortland, OR


  • Chip MultiProcessors
  • Network-on-chip
  • RF-interconnect


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