TY - GEN
T1 - Resonant pressure sensing using a micromechanical cantilever actuated by fringing electrostatic fields
AU - Krakover, Naftaly
AU - Hic, B. Robert
AU - Krylov, Slava
N1 - Publisher Copyright:
© 2018 IEEE.
PY - 2018/4/24
Y1 - 2018/4/24
N2 - We demonstrate a pressure-sensing approach based on the resonant operation of a single-crystal Si cantilever positioned near a flexible, pressurized membrane. The membrane deflection perturbs the electrostatic force acting on the cantilever and consequently alters the beam's resonant frequency. Sensitivity was enhanced by tailoring the actuating force nonlinearities through fringing electrostatic fields. With our coupled micromechanical system, we achieved frequency sensitivity to pressure and displacement of ≈ 30 Hz/kPa and -4 Hz/nm, respectively. Our results indicate that the suggested approach may have applications not only for pressure measurements, but also in a broad range of microelectromechanical resonant inertial, force, mass and bio sensors.
AB - We demonstrate a pressure-sensing approach based on the resonant operation of a single-crystal Si cantilever positioned near a flexible, pressurized membrane. The membrane deflection perturbs the electrostatic force acting on the cantilever and consequently alters the beam's resonant frequency. Sensitivity was enhanced by tailoring the actuating force nonlinearities through fringing electrostatic fields. With our coupled micromechanical system, we achieved frequency sensitivity to pressure and displacement of ≈ 30 Hz/kPa and -4 Hz/nm, respectively. Our results indicate that the suggested approach may have applications not only for pressure measurements, but also in a broad range of microelectromechanical resonant inertial, force, mass and bio sensors.
UR - http://www.scopus.com/inward/record.url?scp=85047005732&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2018.8346688
DO - 10.1109/MEMSYS.2018.8346688
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AN - SCOPUS:85047005732
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 846
EP - 849
BT - 2018 IEEE Micro Electro Mechanical Systems, MEMS 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 31st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2018
Y2 - 21 January 2018 through 25 January 2018
ER -