Abstract
The growth of polycrystalline metallic thin films is widely investigated by diverse in situ and ex situ analytical techniques. Significant research is dedicated to developing methods for monitoring surface coverage and morphology changes during the early stages of growth and to studying growth-mode characteristics. In this work, we demonstrate use of the electrical four-point probes (FPP) technique to examine changes in resistivity during tungsten growth over titanium nitride (TiN) and before a full surface coverage are assembled by the new tungsten phase. Results suggest the formation of electrical percolation paths at ∼35% surface coverage of tungsten on TiN substrate.
Original language | English |
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Pages (from-to) | 134-136 |
Number of pages | 3 |
Journal | Microelectronic Engineering |
Volume | 92 |
DOIs | |
State | Published - Apr 2012 |