Process of CoPt alloys electrodeposition for MEMS/NEMS applications

O. Berkh*, Y. Shacham-Diamand, E. Gileadi

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

CoPt electrodeposited alloys present high interest for application in MEMS/NEMS, because of their interesting magnetic characteristics. Integration of CoPt films into MEMS/NEMS devices is hampered by instability of the deposition process (change of the deposition current efficiency and CoPt alloy characteristics with the total charge passed through the electrolyte in the previous runs). The deposition process of CoPt alloys from ammonium citrate electrolyte containing the diammine-dinitrito-platinum (II) complex as the source of Pt is considered in terms of its stability and reliability. Removal of NO2- ligands by thermal treatment of Pt complex allows the elimination of the total charge effect on deposition current efficiency. The role of ammonia loss during pretreatment and operation is discussed.

Original languageEnglish
Title of host publicationECS Transactions - Magnetic Materials, Processes and Devices 10 - 214th ECS Meeting
Pages101-117
Number of pages17
Edition45
DOIs
StatePublished - 2009
EventMagnetic Materials, Processes and Devices 10 - 214th ECS Meeting - Honolulu, HI, United States
Duration: 12 Oct 200817 Oct 2008

Publication series

NameECS Transactions
Number45
Volume16
ISSN (Print)1938-5862
ISSN (Electronic)1938-6737

Conference

ConferenceMagnetic Materials, Processes and Devices 10 - 214th ECS Meeting
Country/TerritoryUnited States
CityHonolulu, HI
Period12/10/0817/10/08

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