PLANARIZATION WITH SPIN-ON-GLASS/LPCVD COMPOSITE FILMS.

F. Dupuis*, W. G. Oldham, Y. Shacham-Diamand

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

A physical and electrical evaluation of the feasibility of planarization by means of composite films has been carried out. The use of even a very thin spin-on film underneath a conventional LPCVD PSG oxide film significantly improves the final topography. The electrical properties of the undoped PSG film are consistent with use in CMOS VLSI technologies.

Original languageEnglish
Title of host publicationDigest of Technical Papers - Symposium on VLSI Technology
PublisherBusiness Cent for Academic Soc Japan
Pages52-53
Number of pages2
ISBN (Print)4930813093
StatePublished - 1985
Externally publishedYes

Publication series

NameDigest of Technical Papers - Symposium on VLSI Technology
ISSN (Print)0743-1562

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