Abstract
The crack velocity in glass and single-crystal silicon was experimentally studied by subjecting strip-like silicon and silicate glass specimens to three-point bending loading to fracture. A notch was introduced to each of the specimens with 0.15- and 0.3-mm-thick diamond saws to depths of 0.1 to 1.5 mm, respectively. Crack velocity was studied in a geometry that constrained the crack profile to a nearly quarter elliptical shape. Direct measurements indicated that the crack velocity along this profile decreased to less than 1% of the Rayleigh wave speed, at room temperature and at 77 K.
| Original language | English |
|---|---|
| Pages (from-to) | 2429-2434 |
| Number of pages | 6 |
| Journal | Journal of Applied Physics |
| Volume | 93 |
| Issue number | 5 |
| DOIs | |
| State | Published - 1 Mar 2003 |
| Externally published | Yes |