Novel method for debug of electrostatic discharge protection in VLSI circuits

Sergey Sofer*, Yefim Fefer, Mariana Borenshtein, Yoram Shapira

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

2 Scopus citations

Abstract

A proposed method for failure analysis and debugging of electrostatic discharge protection in VLSI circuits is presented, based on low-energy non-destructive emulation of real ESD stress. It allows on-die current and voltage measurements during stress, providing a direct and clear conclusion about the proper functioning of the protection method, or a reason for failure.

Original languageEnglish
Title of host publicationProceedings of 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006
Pages265-269
Number of pages5
DOIs
StatePublished - 2006
Event13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006 - Singapore, Singapore
Duration: 3 Jul 20067 Jul 2006

Publication series

NameProceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA

Conference

Conference13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006
Country/TerritorySingapore
CitySingapore
Period3/07/067/07/06

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