TY - GEN
T1 - Novel method for debug of electrostatic discharge protection in VLSI circuits
AU - Sofer, Sergey
AU - Fefer, Yefim
AU - Borenshtein, Mariana
AU - Shapira, Yoram
PY - 2006
Y1 - 2006
N2 - A proposed method for failure analysis and debugging of electrostatic discharge protection in VLSI circuits is presented, based on low-energy non-destructive emulation of real ESD stress. It allows on-die current and voltage measurements during stress, providing a direct and clear conclusion about the proper functioning of the protection method, or a reason for failure.
AB - A proposed method for failure analysis and debugging of electrostatic discharge protection in VLSI circuits is presented, based on low-energy non-destructive emulation of real ESD stress. It allows on-die current and voltage measurements during stress, providing a direct and clear conclusion about the proper functioning of the protection method, or a reason for failure.
UR - http://www.scopus.com/inward/record.url?scp=34250628896&partnerID=8YFLogxK
U2 - 10.1109/IPFA.2006.251043
DO - 10.1109/IPFA.2006.251043
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AN - SCOPUS:34250628896
SN - 1424402069
SN - 9781424402069
T3 - Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA
SP - 265
EP - 269
BT - Proceedings of 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006
T2 - 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA 2006
Y2 - 3 July 2006 through 7 July 2006
ER -