Nonuniform RF overstress in high-power transistors and amplifiers

Alon Stopel*, Mark Leibovitch, Yoran Shapira

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

Nonuniform light emission from power transistors at 2-3-dB compression levels has been imaged using a microscope-mounted camera. The nonuniformity depends on the device lateral geometry, load impedance, dc and radio frequency (RF) conditions, and the negative gate current, which is a result of the RF-induced impact ionization in the transistors. Numerical simulations demonstrated a nonuniform distribution of the RF overstress in the transistors under the same conditions. The simulations indicate that the nonuniformity in the light intensity may be attributed to the RF-induced voltage overstress. Therefore, the observed light emission may be used as a direct and contactless monitor of the RF-induced overstress in transistors and power amplifiers.

Original languageEnglish
Pages (from-to)1067-1073
Number of pages7
JournalIEEE Transactions on Electron Devices
Volume55
Issue number4
DOIs
StatePublished - Apr 2008

Keywords

  • Breakdown
  • High-power amplifier (HPA)
  • Impact ionization (II)
  • Light emission
  • Parasitic oscillations
  • Power transistor

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