Nanocrystalline Conformal Diffusion Barriers for Copper Metallization

M. Eizenberg; Amit Kohn; S. Joseph

Nanocrystalline Conformal Diffusion Barriers for Copper Metallization

M. Eizenberg, Amit Kohn, S. Joseph

Department of Materials Science and Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Original language	American English
Title of host publication	Advanced Metallization Conference 2002 (AMC 2002)
Editors	Bradley M. Melnick, Timothy S. Cale, Shigeaki Zaima, Tomohiro Ohta
Pages	745-745
Number of pages	1
Volume	18
State	Published - 2003
Event	Advanced Metallization Conference 2002 (AMC 2002) - San Diego, United States Duration: 1 Oct 2002 → 3 Oct 2002

Publication series

Name	Materials Research Society conference proceedings
Publisher	Materials Research Society

Conference

Conference	Advanced Metallization Conference 2002 (AMC 2002)
Abbreviated title	AMC 2002
Country/Territory	United States
City	San Diego
Period	1/10/02 → 3/10/02

Cite this

@inproceedings{a37a580a33f245d7be81b9f4e159bc7f,

title = "Nanocrystalline Conformal Diffusion Barriers for Copper Metallization",

author = "M. Eizenberg and Amit Kohn and S. Joseph",

year = "2003",

language = "American English",

isbn = "1558997199 ",

volume = "18",

series = "Materials Research Society conference proceedings",

publisher = "Materials Research Society",

pages = "745--745",

editor = "Melnick, {Bradley M. } and Cale, {Timothy S. } and Zaima, {Shigeaki } and Ohta, {Tomohiro }",

booktitle = "Advanced Metallization Conference 2002 (AMC 2002)",

note = "Advanced Metallization Conference 2002 (AMC 2002), AMC 2002 ; Conference date: 01-10-2002 Through 03-10-2002",

}

Eizenberg, M, Kohn, A & Joseph, S 2003, Nanocrystalline Conformal Diffusion Barriers for Copper Metallization. in BM Melnick, TS Cale, S Zaima & T Ohta (eds), Advanced Metallization Conference 2002 (AMC 2002) . vol. 18, Materials Research Society conference proceedings, pp. 745-745, Advanced Metallization Conference 2002 (AMC 2002), San Diego, United States, 1/10/02.

Nanocrystalline Conformal Diffusion Barriers for Copper Metallization. / Eizenberg, M.; Kohn, Amit; Joseph, S.
Advanced Metallization Conference 2002 (AMC 2002) . ed. / Bradley M. Melnick; Timothy S. Cale; Shigeaki Zaima; Tomohiro Ohta. Vol. 18 2003. p. 745-745 (Materials Research Society conference proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Nanocrystalline Conformal Diffusion Barriers for Copper Metallization

AU - Eizenberg, M.

AU - Kohn, Amit

AU - Joseph, S.

PY - 2003

Y1 - 2003

M3 - Conference contribution

SN - 1558997199

SN - 9781558997196

VL - 18

T3 - Materials Research Society conference proceedings

SP - 745

EP - 745

BT - Advanced Metallization Conference 2002 (AMC 2002)

A2 - Melnick, Bradley M.

A2 - Cale, Timothy S.

A2 - Zaima, Shigeaki

A2 - Ohta, Tomohiro

T2 - Advanced Metallization Conference 2002 (AMC 2002)

Y2 - 1 October 2002 through 3 October 2002

ER -