Modeling the electro-thermal response of thermally isolated micromachined distributed structures

Eran Socher*, Ofir Bochobza-Degani, David Elata, Yael Nemirovsky

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This work analyzes the electro-thermal behavior of thermally isolated micromachined resistive structures. Micromachined resistive microbridges are modeled using a quasi-ID heat balance equation taking into account the resistance dependence upon local temperature. A novel numerical scheme for solving the coupled electro-thermal problem is suggested. The scheme is based on applied temperature rather than applied current or voltage. The novel scheme can capture the thermal instabilities under both voltage and current control, for various types of materials. The model is compared with experimental data measured on surface micromachined polysilicon structures, showing good agreement.

Original languageEnglish
Title of host publication2003 Nanotechnology Conference and Trade Show - Nanotech 2003
EditorsM. Laudon, B. Romanowicz
Pages384-387
Number of pages4
StatePublished - 2003
Externally publishedYes
Event2003 Nanotechnology Conference and Trade Show - Nanotech 2003 - San Francisco, CA, United States
Duration: 23 Feb 200327 Feb 2003

Publication series

Name2003 Nanotechnology Conference and Trade Show - Nanotech 2003
Volume1

Conference

Conference2003 Nanotechnology Conference and Trade Show - Nanotech 2003
Country/TerritoryUnited States
CitySan Francisco, CA
Period23/02/0327/02/03

Keywords

  • Electro-thermal instability
  • Electro-thermal modeling
  • MEMS
  • Micro-electro-thermal devices
  • Thermal runaway

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