Microelectroplating of nickel for MEMS applications

I. R. Chertkow*, N. A. Travitzky, A. Moshaiov, Alexandra S. Inberg

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review


Microelectroplating of nickel was proposed as a new approach for MEMS applications. A technique is developed to carry the solution to the exact substrate area, where electrodeposition should take place. It is shown that microelectroplating can be implemented without immersing the entire device in the solution. A microtube brings the solution to the required zone. On contact, electroplating takes place at the substrate in a region bounded by the liquid capillary forces. During the process, the tube is moved over the substrate while surface tension impedes the liquid from spreading. Several effects have an impact on microelectroplating, especially surface tension and formation of bubbles.

Original languageEnglish
Pages (from-to)43-48
Number of pages6
JournalJournal of Optoelectronics and Advanced Materials
Issue number3
StatePublished - 1999


  • Capillary tube
  • Electroplating
  • Microelectroplating
  • Surface tension


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