TY - JOUR
T1 - Measurement of ion flux as a function of background gas pressure in a hot refractory anode vacuum arc
AU - Beilis, Isak K.
AU - Shashurin, Alexey
AU - Boxman, R. L.
N1 - Funding Information:
Manuscript received May 16, 2006; revised December 26, 2006. This work was supported by a grant from the Israel Science Foundation. The authors are with the Electrical Discharge and Plasma Laboratory, Department of Interdisciplinary Studies, School of Electrical Engineering, Fleischman Faculty of Engineering, Tel Aviv University, Tel Aviv 69978, Israel (e-mail: [email protected]). Digital Object Identifier 10.1109/TPS.2007.896751
PY - 2007/8
Y1 - 2007/8
N2 - The hot refractory anode vacuum arc (HRAVA) is a metallic plasma source in which plasma expands radially from the interelectrode gap and may deposit substrates circumferentially disposed around the electrode axis. The dependence of copper ion flux expanding from the HRAVA interelectrode gap was determined as a function of background gas pressure. The fraction of the ion flux in the radially expanding plasma flux was obtained by measuring the ion current and the film thickness. Experiments were conducted with arc currents of 145-250 A, a molybdenum anode, and an electrode separation of about 10 mm. The saturation ion current was measured with a circular flat probe with 10-mm diameter biased at -30 V with respect to the anode. It was found that the collected ion current in vacuum was almost constant during the first 30 s of the arc- ∼2.5 mA/cm2 at a distance of 110 mm from the arc axis, with an arc current of 200 A, and increased to a steady-state value in the developed HRAVA (t > 40 s) of ∼5.5 mA/cm2. The measured ion current in argon, nitrogen, and helium environments and the deposition rate in nitrogen remained approximately constant with background gas pressure up to some critical pressure and, then, decreased with pressure eventually reaching zero. The critical pressures were 2, 4, and 10 Pa for argon, nitrogen, and helium, respectively. The critical nitrogen pressure for the deposition rate was 2 Pa in contrast with 4 Pa for the ion current. The ion fraction in total deposition flux was 0.6 in vacuum and decreased with nitrogen pressure, except that a local maximum of ∼0.8 was observed at ∼13 Pa.
AB - The hot refractory anode vacuum arc (HRAVA) is a metallic plasma source in which plasma expands radially from the interelectrode gap and may deposit substrates circumferentially disposed around the electrode axis. The dependence of copper ion flux expanding from the HRAVA interelectrode gap was determined as a function of background gas pressure. The fraction of the ion flux in the radially expanding plasma flux was obtained by measuring the ion current and the film thickness. Experiments were conducted with arc currents of 145-250 A, a molybdenum anode, and an electrode separation of about 10 mm. The saturation ion current was measured with a circular flat probe with 10-mm diameter biased at -30 V with respect to the anode. It was found that the collected ion current in vacuum was almost constant during the first 30 s of the arc- ∼2.5 mA/cm2 at a distance of 110 mm from the arc axis, with an arc current of 200 A, and increased to a steady-state value in the developed HRAVA (t > 40 s) of ∼5.5 mA/cm2. The measured ion current in argon, nitrogen, and helium environments and the deposition rate in nitrogen remained approximately constant with background gas pressure up to some critical pressure and, then, decreased with pressure eventually reaching zero. The critical pressures were 2, 4, and 10 Pa for argon, nitrogen, and helium, respectively. The critical nitrogen pressure for the deposition rate was 2 Pa in contrast with 4 Pa for the ion current. The ion fraction in total deposition flux was 0.6 in vacuum and decreased with nitrogen pressure, except that a local maximum of ∼0.8 was observed at ∼13 Pa.
KW - Background gas
KW - Degree of ionization
KW - Hot refractory anode
KW - Ion flux
KW - Plasma plume
KW - Vacuum arcs
UR - http://www.scopus.com/inward/record.url?scp=34548234911&partnerID=8YFLogxK
U2 - 10.1109/TPS.2007.896751
DO - 10.1109/TPS.2007.896751
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AN - SCOPUS:34548234911
SN - 0093-3813
VL - 35
SP - 973
EP - 979
JO - IEEE Transactions on Plasma Science
JF - IEEE Transactions on Plasma Science
IS - 4 II
ER -