Material and electrical properties of electroless Ag-W thin film

A. Inberg*, Y. Shacham-Diamand, E. Rabinovich, G. Golan, N. Croitoru

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review


Thin Ag-W films were prepared on Si (100) substrate and on metal (Ag and Co) seed layers by electroless technology for ULSI applications. The thin film electrical and physical parameters were studied as a function of the film composition. The thin film composition depends on the electroless bath formula. The role of the tungsten in silver matrix was studied via measurements of the film microhardness and thermal stability as function of the composition. The AgW films, thicker than 200 nm, exhibited a specific electrical resistivity, of about 2μΩ*cm and a reflectivity larger than 90%. These films have not corroded in air at temperatures up to 200°C (thermal stable). Therefore, we assume that silvertungsten films can be used for applications where reliable conducting thin films is required, such as packaging and interconnects for microelectronics.

Original languageEnglish
Pages (from-to)355-359
Number of pages5
JournalJournal of Electronic Materials
Issue number4
StatePublished - Apr 2001


  • Electrical resistivity
  • Electroless deposition
  • Microhardness
  • Reflectivity
  • Silver
  • Tungsten


Dive into the research topics of 'Material and electrical properties of electroless Ag-W thin film'. Together they form a unique fingerprint.

Cite this