TY - GEN
T1 - Magnetic control in vacuum arc deposition a review
AU - Boxman, R. L.
AU - Beilis, I. I.
AU - Gidalevich, E.
AU - Zhitomirsky, V. N.
PY - 2004
Y1 - 2004
N2 - The use of magnetic fields to control cathode spot location and motion and to collimate and direct the plasma flow in vacuum arc deposition apparatus is reviewed. Retrograde and acute angle motion are used to control the location and motion of cathode spots, in order to confine them to the cathode surface facing the substrates, to prevent local overheating, and to reduce macroparticle production. Axial fields are use to collimate cathode spot produced plasma jets, and to bend them around macoparticle occluding obstacles in filtered vacuum arc deposition. Advances have been made in understanding these phenomena, but theoretical models have not yet been formulated which can predict plasma behavior sufficiently well for apparatus design.
AB - The use of magnetic fields to control cathode spot location and motion and to collimate and direct the plasma flow in vacuum arc deposition apparatus is reviewed. Retrograde and acute angle motion are used to control the location and motion of cathode spots, in order to confine them to the cathode surface facing the substrates, to prevent local overheating, and to reduce macroparticle production. Axial fields are use to collimate cathode spot produced plasma jets, and to bend them around macoparticle occluding obstacles in filtered vacuum arc deposition. Advances have been made in understanding these phenomena, but theoretical models have not yet been formulated which can predict plasma behavior sufficiently well for apparatus design.
UR - http://www.scopus.com/inward/record.url?scp=16344377120&partnerID=8YFLogxK
U2 - 10.1109/DEIV.2004.1422650
DO - 10.1109/DEIV.2004.1422650
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AN - SCOPUS:16344377120
SN - 078038461X
T3 - Proceedings - International Symposium on Discharges and Electrical Insulation in Vacuum, ISDEIV
SP - 473
EP - 479
BT - Proceedings - XXIth International Symposium on Discharges and Electrical Insulation in Vacuum, ISDEIV
T2 - Proceedings - XXIth International Symposium on Discharges and Electrical Insulation in Vacuum, ISDEIV
Y2 - 27 September 2004 through 1 October 2004
ER -