Localized heating, melting, and drilling of silicon

P. Livshits; V. Dikhtyar; E. Jerby

Localized heating, melting, and drilling of silicon

P. Livshits, V. Dikhtyar, E. Jerby^*

^*Corresponding author for this work

School of Electrical Engineering

Tel Aviv University

Research output: Contribution to conference › Paper › peer-review

2 Scopus citations

Abstract

The microwave drill [1] is used in this study for a localized heating of silicon plates, up to the melting point. The paper presents the experimental setup, including the heating device and the temperature measurement techniques. The experimental results show a higher rate of local temperature increase compared to other known methods. This heating method enables localized thermal processes, jointing, welding, and even drilling of >0.1-mm diameter holes in silicon for MEMS applications.

Original language	English
Pages	1677
Number of pages	1
State	Published - 2004
Event	2004 AIChE Annual Meeting - Austin, TX, United States Duration: 7 Nov 2004 → 12 Nov 2004

Conference

Conference	2004 AIChE Annual Meeting
Country/Territory	United States
City	Austin, TX
Period	7/11/04 → 12/11/04

Cite this

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title = "Localized heating, melting, and drilling of silicon",

abstract = "The microwave drill [1] is used in this study for a localized heating of silicon plates, up to the melting point. The paper presents the experimental setup, including the heating device and the temperature measurement techniques. The experimental results show a higher rate of local temperature increase compared to other known methods. This heating method enables localized thermal processes, jointing, welding, and even drilling of >0.1-mm diameter holes in silicon for MEMS applications.",

author = "P. Livshits and V. Dikhtyar and E. Jerby",

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AU - Livshits, P.

AU - Dikhtyar, V.

AU - Jerby, E.

PY - 2004

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N2 - The microwave drill [1] is used in this study for a localized heating of silicon plates, up to the melting point. The paper presents the experimental setup, including the heating device and the temperature measurement techniques. The experimental results show a higher rate of local temperature increase compared to other known methods. This heating method enables localized thermal processes, jointing, welding, and even drilling of >0.1-mm diameter holes in silicon for MEMS applications.

AB - The microwave drill [1] is used in this study for a localized heating of silicon plates, up to the melting point. The paper presents the experimental setup, including the heating device and the temperature measurement techniques. The experimental results show a higher rate of local temperature increase compared to other known methods. This heating method enables localized thermal processes, jointing, welding, and even drilling of >0.1-mm diameter holes in silicon for MEMS applications.

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T2 - 2004 AIChE Annual Meeting

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ER -

Localized heating, melting, and drilling of silicon

Abstract

Conference

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