L1-L2 interconnect design methodology and arbitration in 3-D IC multicore compute clusters

Alexei Jolondz*, Shlomo Weiss, Amit Golander

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

We introduce a novel 3-D implementation of the interconnect between cores and shared L2 cache banks for multicore clusters. The 3-D structure extends cluster sizes that can be supported with tolerable wire delays. As a result of the shorter connections achieved by splitting existing 2-D design into four layers, performance is improved and area and power are reduced. The splitting enables implementation of a better arbitration scheme, which leads to additional performance improvement.

Original languageEnglish
Article number6908070
Pages (from-to)2206-2210
Number of pages5
JournalIEEE Transactions on Very Large Scale Integration (VLSI) Systems
Volume22
Issue number10
DOIs
StatePublished - 1 Oct 2014

Keywords

  • 3-D integrated circuit (IC)
  • Multilevel cache.
  • interconnect
  • multicore

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