Abstract
We introduce a novel 3-D implementation of the interconnect between cores and shared L2 cache banks for multicore clusters. The 3-D structure extends cluster sizes that can be supported with tolerable wire delays. As a result of the shorter connections achieved by splitting existing 2-D design into four layers, performance is improved and area and power are reduced. The splitting enables implementation of a better arbitration scheme, which leads to additional performance improvement.
Original language | English |
---|---|
Article number | 6908070 |
Pages (from-to) | 2206-2210 |
Number of pages | 5 |
Journal | IEEE Transactions on Very Large Scale Integration (VLSI) Systems |
Volume | 22 |
Issue number | 10 |
DOIs | |
State | Published - 1 Oct 2014 |
Keywords
- 3-D integrated circuit (IC)
- Multilevel cache.
- interconnect
- multicore