Intrinsic compressive stress in polycrystalline films with negligible grain boundary diffusion

Brian W. Sheldon; Adi Ditkowski; R. Beresford; Eric Chason; Janet Rankin

doi:10.1063/1.1575916

Intrinsic compressive stress in polycrystalline films with negligible grain boundary diffusion

Brian W. Sheldon^*
, Adi Ditkowski
, R. Beresford
, Eric Chason
, Janet Rankin

^*Corresponding author for this work

Brown University

Research output: Contribution to journal › Article › peer-review

35 Scopus citations

Abstract

Intrinsic compressive stress in polycrystalline films with negligible grain boundary diffusion was investigated. The stresses were attributed to the insertion of excess adatoms at grain boundaries. The strain profiles were determined by the ratio of the atom insertion and growth rates in the absence of grain boundary diffusion.

Original language	English
Pages (from-to)	948-957
Number of pages	10
Journal	Journal of Applied Physics
Volume	94
Issue number	2
DOIs	https://doi.org/10.1063/1.1575916
State	Published - 15 Jul 2003
Externally published	Yes

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title = "Intrinsic compressive stress in polycrystalline films with negligible grain boundary diffusion",

abstract = "Intrinsic compressive stress in polycrystalline films with negligible grain boundary diffusion was investigated. The stresses were attributed to the insertion of excess adatoms at grain boundaries. The strain profiles were determined by the ratio of the atom insertion and growth rates in the absence of grain boundary diffusion.",

author = "Sheldon, \{Brian W.\} and Adi Ditkowski and R. Beresford and Eric Chason and Janet Rankin",

year = "2003",

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AU - Sheldon, Brian W.

AU - Ditkowski, Adi

AU - Beresford, R.

AU - Chason, Eric

AU - Rankin, Janet

PY - 2003/7/15

Y1 - 2003/7/15

N2 - Intrinsic compressive stress in polycrystalline films with negligible grain boundary diffusion was investigated. The stresses were attributed to the insertion of excess adatoms at grain boundaries. The strain profiles were determined by the ratio of the atom insertion and growth rates in the absence of grain boundary diffusion.

AB - Intrinsic compressive stress in polycrystalline films with negligible grain boundary diffusion was investigated. The stresses were attributed to the insertion of excess adatoms at grain boundaries. The strain profiles were determined by the ratio of the atom insertion and growth rates in the absence of grain boundary diffusion.

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JO - Journal of Applied Physics

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IS - 2

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Intrinsic compressive stress in polycrystalline films with negligible grain boundary diffusion

Abstract

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