Inter-Symbol Interference (ISI) in on-die transmission lines

A. Rysin, P. Livshits, S. Sofer, O. Mantel, Y. Shapira, Y. Fefer

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The waveforms of a signal transmitted through single-ended on-die transmission lines, implemented by standard metal layers of a CMOS 45 nm technology node, have been experimentally studied. The influence of the active loss level of the lines, as well as of the impedance mismatch between the transmission line and its driver upon the signal distortion, and particularly upon the inter-symbol interference, is discussed.

Original languageEnglish
Title of host publication2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems, COMCAS 2009
DOIs
StatePublished - 2009
Event2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems, COMCAS 2009 - Tel Aviv, Israel
Duration: 9 Nov 200911 Nov 2009

Publication series

Name2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems, COMCAS 2009

Conference

Conference2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems, COMCAS 2009
Country/TerritoryIsrael
CityTel Aviv
Period9/11/0911/11/09

Keywords

  • Global wiring
  • Inter-symbol interference
  • On-chip interconnections
  • On-chip transmission line
  • Transmission line
  • VLSI

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