TY - GEN
T1 - Inter-Symbol Interference (ISI) in on-die transmission lines
AU - Rysin, A.
AU - Livshits, P.
AU - Sofer, S.
AU - Mantel, O.
AU - Shapira, Y.
AU - Fefer, Y.
PY - 2009
Y1 - 2009
N2 - The waveforms of a signal transmitted through single-ended on-die transmission lines, implemented by standard metal layers of a CMOS 45 nm technology node, have been experimentally studied. The influence of the active loss level of the lines, as well as of the impedance mismatch between the transmission line and its driver upon the signal distortion, and particularly upon the inter-symbol interference, is discussed.
AB - The waveforms of a signal transmitted through single-ended on-die transmission lines, implemented by standard metal layers of a CMOS 45 nm technology node, have been experimentally studied. The influence of the active loss level of the lines, as well as of the impedance mismatch between the transmission line and its driver upon the signal distortion, and particularly upon the inter-symbol interference, is discussed.
KW - Global wiring
KW - Inter-symbol interference
KW - On-chip interconnections
KW - On-chip transmission line
KW - Transmission line
KW - VLSI
UR - http://www.scopus.com/inward/record.url?scp=77949788578&partnerID=8YFLogxK
U2 - 10.1109/COMCAS.2009.5385987
DO - 10.1109/COMCAS.2009.5385987
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AN - SCOPUS:77949788578
SN - 9781424439850
T3 - 2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems, COMCAS 2009
BT - 2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems, COMCAS 2009
T2 - 2009 IEEE International Conference on Microwaves, Communications, Antennas and Electronics Systems, COMCAS 2009
Y2 - 9 November 2009 through 11 November 2009
ER -