Integration of laser die transfer and magnetic self-assembly for ultra-thin chip placement

In this paper, we demonstrate the integration of a novel self-assembly method with laser die transfer for ultra-thin chip (UTC) placement. The laser die transfer technique provides high speed chip presentation into the assembly positions on the substrate, where the magnetic self-assembly traps and aligns the chips. Combination of these two technologies allows handling of UTCs without a direct mechanical contact throughout the assembly flow and provides high precision chip placement.