Hillock formation during electromigration in Cu and Al thin films: Three-dimensional grain growth

A. Gladkikh, Y. Lereah, E. Glickman, M. Karpovski, A. Palevski, J. Schubert

Research output: Contribution to journalArticlepeer-review

Abstract

The evolution of microstructure in Al and Cu thin film lines during electromigration has been studied using a transmission electron microscopy. Grain boundary migration was found to be critically involved in the electromigration induced hillock formation that can be described as a three-dimensional growth of a single grain.

Original languageEnglish
Pages (from-to)1214
Number of pages1
JournalApplied Physics Letters
DOIs
StatePublished - 1995

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