Highly corrosion resistant bright silver metallization deposited from a neutral cyanide-free solution

N. Fishelson*, A. Inberg, N. Croitoru, Y. Shacham-Diamand

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

In this paper, we describe a new method for preparing the high-quality silver films that can be used for packaging level interconnects. Silver has excellent optical and electrical properties but its application in microelectronics is compromised due to its tendency to sulfide corrosion. Another problem is hazardous cyanide electrolytes/bath technology that has to be improved. We present bright silver films obtained by electrodeposition from near to neutral non cyanide solution. High corrosion resistance was achieved by Ag protection with organic SAMs. The SAM protection power was quantified by comparison of para-amino phenol (PAP) peak current decrease in Cyclic Voltammetry (CV) and the Electron (charge) Transfer Resistance (CTR) increase from Electrochemical Impedance Spectroscopy (EIS). The accelerated tarnishing tests in H 2S atmosphere well support the electrochemical test results.

Original languageEnglish
Pages (from-to)126-129
Number of pages4
JournalMicroelectronic Engineering
Volume92
DOIs
StatePublished - Apr 2012

Keywords

  • Corrosion protection
  • Electrochemical impedance spectroscopy
  • SAM characterization
  • Self-assembled monolayers
  • Silver electrodeposition

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