TY - JOUR
T1 - Highly corrosion resistant bright silver metallization deposited from a neutral cyanide-free solution
AU - Fishelson, N.
AU - Inberg, A.
AU - Croitoru, N.
AU - Shacham-Diamand, Y.
PY - 2012/4
Y1 - 2012/4
N2 - In this paper, we describe a new method for preparing the high-quality silver films that can be used for packaging level interconnects. Silver has excellent optical and electrical properties but its application in microelectronics is compromised due to its tendency to sulfide corrosion. Another problem is hazardous cyanide electrolytes/bath technology that has to be improved. We present bright silver films obtained by electrodeposition from near to neutral non cyanide solution. High corrosion resistance was achieved by Ag protection with organic SAMs. The SAM protection power was quantified by comparison of para-amino phenol (PAP) peak current decrease in Cyclic Voltammetry (CV) and the Electron (charge) Transfer Resistance (CTR) increase from Electrochemical Impedance Spectroscopy (EIS). The accelerated tarnishing tests in H 2S atmosphere well support the electrochemical test results.
AB - In this paper, we describe a new method for preparing the high-quality silver films that can be used for packaging level interconnects. Silver has excellent optical and electrical properties but its application in microelectronics is compromised due to its tendency to sulfide corrosion. Another problem is hazardous cyanide electrolytes/bath technology that has to be improved. We present bright silver films obtained by electrodeposition from near to neutral non cyanide solution. High corrosion resistance was achieved by Ag protection with organic SAMs. The SAM protection power was quantified by comparison of para-amino phenol (PAP) peak current decrease in Cyclic Voltammetry (CV) and the Electron (charge) Transfer Resistance (CTR) increase from Electrochemical Impedance Spectroscopy (EIS). The accelerated tarnishing tests in H 2S atmosphere well support the electrochemical test results.
KW - Corrosion protection
KW - Electrochemical impedance spectroscopy
KW - SAM characterization
KW - Self-assembled monolayers
KW - Silver electrodeposition
UR - http://www.scopus.com/inward/record.url?scp=84858294735&partnerID=8YFLogxK
U2 - 10.1016/j.mee.2011.04.016
DO - 10.1016/j.mee.2011.04.016
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AN - SCOPUS:84858294735
SN - 0167-9317
VL - 92
SP - 126
EP - 129
JO - Microelectronic Engineering
JF - Microelectronic Engineering
ER -