High aspect ratio quarter-micron electroless copper integrated technology

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	11-14
Number of pages	4
Journal	Vide: Science, Technique et Applications
Volume	53
Issue number	283 SUPPL.
DOIs	https://doi.org/10.1109/mam.1997.621041
State	Published - 1997
Externally published	Yes

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title = "High aspect ratio quarter-micron electroless copper integrated technology",

author = "Y. Shacham-Diamand and Lopatin, {S. Y.}",

year = "1997",

doi = "10.1109/mam.1997.621041",

language = "אנגלית",

volume = "53",

pages = "11--14",

journal = "Vide: Science, Technique et Applications",

issn = "1266-0167",

publisher = "Societe Francaise du Vide",

number = "283 SUPPL.",

}

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AU - Lopatin, S. Y.

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JO - Vide: Science, Technique et Applications

JF - Vide: Science, Technique et Applications

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