High aspect ratio quarter-micron electroless copper integrated technology

Y. Shacham-Diamand, S. Y. Lopatin

Research output: Contribution to journalArticlepeer-review

Original languageEnglish
Pages (from-to)11-14
Number of pages4
JournalVide: Science, Technique et Applications
Volume53
Issue number283 SUPPL.
DOIs
StatePublished - 1997
Externally publishedYes

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