TY - GEN
T1 - Heat transfer enhancement in micro-scale air flows
AU - Rosenfeld, Moshe
N1 - Publisher Copyright:
© IEEE / Therminic 2016.
PY - 2016/11/18
Y1 - 2016/11/18
N2 - The aim of the present study is to extend air-cooling capabilities. A method of generating an unsteady vortical flow within small annular channels is introduced and studied numerically. The addition of an orifice at the entrance to the channel generates a propagating train of vortex rings that induces the continuous eruption of hot air from the wall region into the core flow. The overall effect is significant transverse convection even in laminar flows and enhancement of heat transfer. The effect of the orifice diameter is studied in detail. The method is very appealing for extending cooling capabilities of heat-sinks based on air, but it works similarly well for single phase flow of liquid. An increase of almost two-fold in the heat dissipation relative to a standard microchannel can be obtained. Heat dissipation of 8watt/cm2 per contact area can be anticipated using a single layer of the proposed air-based orificed-microchannel.
AB - The aim of the present study is to extend air-cooling capabilities. A method of generating an unsteady vortical flow within small annular channels is introduced and studied numerically. The addition of an orifice at the entrance to the channel generates a propagating train of vortex rings that induces the continuous eruption of hot air from the wall region into the core flow. The overall effect is significant transverse convection even in laminar flows and enhancement of heat transfer. The effect of the orifice diameter is studied in detail. The method is very appealing for extending cooling capabilities of heat-sinks based on air, but it works similarly well for single phase flow of liquid. An increase of almost two-fold in the heat dissipation relative to a standard microchannel can be obtained. Heat dissipation of 8watt/cm2 per contact area can be anticipated using a single layer of the proposed air-based orificed-microchannel.
UR - http://www.scopus.com/inward/record.url?scp=85006952932&partnerID=8YFLogxK
U2 - 10.1109/THERMINIC.2016.7749045
DO - 10.1109/THERMINIC.2016.7749045
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AN - SCOPUS:85006952932
T3 - THERMINIC 2016 - 22nd International Workshop on Thermal Investigations of ICs and Systems
SP - 158
EP - 163
BT - THERMINIC 2016 - 22nd International Workshop on Thermal Investigations of ICs and Systems
A2 - Poppe, Andras
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 22nd International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2016
Y2 - 21 September 2016 through 23 September 2016
ER -