Growth study of nanoscale Re-Ni coatings on functionalized SiO 2 using electroless plating

A. Duhin, A. Rozenblat-Raz, L. Burstein, A. Inberg, D. Horvitz, Y. Shacham-Diamand, N. Eliaz*, E. Gileadi

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review


In spite of the unique combination of properties of Re-based alloys and the use of electroless plating in many relevant industries, the early stages of electroless plating of Re-based thin films have not been reported before. This paper is focused on the study of the early stages of growth of ultrathin (<20 nm) Re-Ni films with high Re-content by electroless plating on a functionalized-SiO 2 substrate. Each step, from the modification of the substrate to the formation of a continuous film, is characterized. Moreover, the effect of the addition of Ni 2+ ions to the bath is analyzed. The addition of a low concentration of Ni 2+ ions to the electrolyte is found necessary to obtain full surface coverage and thicker deposits. The as-deposited Re-Ni films consist of both amorphous Ni-Re and H 0.57 ReO 3 phases. The Re-content is not uniform along the thickness of the deposit, and has a maximal value at the percolation point. The deposition process is found to consist of sequential reduction reactions, from ReO 4 - to lower valence oxides, to metallic Re.

Original languageEnglish
Pages (from-to)159-165
Number of pages7
JournalApplied Surface Science
StatePublished - 15 Sep 2014


  • Electroless plating
  • Nucleation and growth
  • Re-Ni alloys
  • Thin film


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