TY - JOUR
T1 - Growth study of nanoscale Re-Ni coatings on functionalized SiO 2 using electroless plating
AU - Duhin, A.
AU - Rozenblat-Raz, A.
AU - Burstein, L.
AU - Inberg, A.
AU - Horvitz, D.
AU - Shacham-Diamand, Y.
AU - Eliaz, N.
AU - Gileadi, E.
N1 - Funding Information:
The financial support from the US Air Force Office of Scientific Research (AFOSR, grant number FA9550-10-1-0520 ) as well as from the Israel Department of Defense (grant number 4440258441 ) is gratefully acknowledged. One of us (A.D.) acknowledges the support of the Israeli Ministry of Science and Technology through a “Woman in Science" scholarship. We also thank Dr. Yishay Feldman from the Department of Materials and Interfaces at the Weizmann Institute of Science for his help in XRD characterization.
PY - 2014/9/15
Y1 - 2014/9/15
N2 - In spite of the unique combination of properties of Re-based alloys and the use of electroless plating in many relevant industries, the early stages of electroless plating of Re-based thin films have not been reported before. This paper is focused on the study of the early stages of growth of ultrathin (<20 nm) Re-Ni films with high Re-content by electroless plating on a functionalized-SiO 2 substrate. Each step, from the modification of the substrate to the formation of a continuous film, is characterized. Moreover, the effect of the addition of Ni 2+ ions to the bath is analyzed. The addition of a low concentration of Ni 2+ ions to the electrolyte is found necessary to obtain full surface coverage and thicker deposits. The as-deposited Re-Ni films consist of both amorphous Ni-Re and H 0.57 ReO 3 phases. The Re-content is not uniform along the thickness of the deposit, and has a maximal value at the percolation point. The deposition process is found to consist of sequential reduction reactions, from ReO 4 - to lower valence oxides, to metallic Re.
AB - In spite of the unique combination of properties of Re-based alloys and the use of electroless plating in many relevant industries, the early stages of electroless plating of Re-based thin films have not been reported before. This paper is focused on the study of the early stages of growth of ultrathin (<20 nm) Re-Ni films with high Re-content by electroless plating on a functionalized-SiO 2 substrate. Each step, from the modification of the substrate to the formation of a continuous film, is characterized. Moreover, the effect of the addition of Ni 2+ ions to the bath is analyzed. The addition of a low concentration of Ni 2+ ions to the electrolyte is found necessary to obtain full surface coverage and thicker deposits. The as-deposited Re-Ni films consist of both amorphous Ni-Re and H 0.57 ReO 3 phases. The Re-content is not uniform along the thickness of the deposit, and has a maximal value at the percolation point. The deposition process is found to consist of sequential reduction reactions, from ReO 4 - to lower valence oxides, to metallic Re.
KW - Electroless plating
KW - Nucleation and growth
KW - Re-Ni alloys
KW - Thin film
UR - http://www.scopus.com/inward/record.url?scp=84904808243&partnerID=8YFLogxK
U2 - 10.1016/j.apsusc.2014.05.178
DO - 10.1016/j.apsusc.2014.05.178
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AN - SCOPUS:84904808243
SN - 0169-4332
VL - 313
SP - 159
EP - 165
JO - Applied Surface Science
JF - Applied Surface Science
ER -