Grain boundary migration and grain growth induced by electromigration in copper and aluminum lines

A. Gladkikh; E. Glickman; M. Karpovsky; Y. Lereah; A. Palevski; J. Shubert

doi:10.1557/proc-391-283

Grain boundary migration and grain growth induced by electromigration in copper and aluminum lines

A. Gladkikh^*
, E. Glickman
, M. Karpovsky
, Y. Lereah
, A. Palevski
, J. Shubert

^*Corresponding author for this work

Tel Aviv University

Research output: Contribution to journal › Conference article › peer-review

2 Scopus citations

Abstract

The changes of microstructure in Al and Cu thin film lines due to electromigration have been studied using transmission electron microscopy. Grain boundary migration, inclination and dislocation activity were found to be critically involved in the electromigration induced hillock formation that can be described as three dimensional grain growth.

Original language	English
Pages (from-to)	283-288
Number of pages	6
Journal	Materials Research Society Symposium - Proceedings
Volume	391
DOIs	https://doi.org/10.1557/proc-391-283
State	Published - 1995
Event	Proceedings of the 1995 MRS Spring Meeting - San Francisco, CA, USA Duration: 17 Apr 1995 → 21 Apr 1995

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title = "Grain boundary migration and grain growth induced by electromigration in copper and aluminum lines",

abstract = "The changes of microstructure in Al and Cu thin film lines due to electromigration have been studied using transmission electron microscopy. Grain boundary migration, inclination and dislocation activity were found to be critically involved in the electromigration induced hillock formation that can be described as three dimensional grain growth.",

author = "A. Gladkikh and E. Glickman and M. Karpovsky and Y. Lereah and A. Palevski and J. Shubert",

year = "1995",

doi = "10.1557/proc-391-283",

language = "אנגלית",

volume = "391",

pages = "283--288",

journal = "Materials Research Society Symposium - Proceedings",

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note = "Proceedings of the 1995 MRS Spring Meeting ; Conference date: 17-04-1995 Through 21-04-1995",

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T1 - Grain boundary migration and grain growth induced by electromigration in copper and aluminum lines

AU - Gladkikh, A.

AU - Glickman, E.

AU - Karpovsky, M.

AU - Lereah, Y.

AU - Palevski, A.

AU - Shubert, J.

PY - 1995

Y1 - 1995

N2 - The changes of microstructure in Al and Cu thin film lines due to electromigration have been studied using transmission electron microscopy. Grain boundary migration, inclination and dislocation activity were found to be critically involved in the electromigration induced hillock formation that can be described as three dimensional grain growth.

AB - The changes of microstructure in Al and Cu thin film lines due to electromigration have been studied using transmission electron microscopy. Grain boundary migration, inclination and dislocation activity were found to be critically involved in the electromigration induced hillock formation that can be described as three dimensional grain growth.

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DO - 10.1557/proc-391-283

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AN - SCOPUS:0029509640

SN - 0272-9172

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JO - Materials Research Society Symposium - Proceedings

JF - Materials Research Society Symposium - Proceedings

T2 - Proceedings of the 1995 MRS Spring Meeting

Y2 - 17 April 1995 through 21 April 1995

ER -

Grain boundary migration and grain growth induced by electromigration in copper and aluminum lines

Abstract

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