TY - JOUR
T1 - Grain boundary migration and grain growth induced by electromigration in copper and aluminum lines
AU - Gladkikh, A.
AU - Glickman, E.
AU - Karpovsky, M.
AU - Lereah, Y.
AU - Palevski, A.
AU - Shubert, J.
PY - 1995
Y1 - 1995
N2 - The changes of microstructure in Al and Cu thin film lines due to electromigration have been studied using transmission electron microscopy. Grain boundary migration, inclination and dislocation activity were found to be critically involved in the electromigration induced hillock formation that can be described as three dimensional grain growth.
AB - The changes of microstructure in Al and Cu thin film lines due to electromigration have been studied using transmission electron microscopy. Grain boundary migration, inclination and dislocation activity were found to be critically involved in the electromigration induced hillock formation that can be described as three dimensional grain growth.
UR - http://www.scopus.com/inward/record.url?scp=0029509640&partnerID=8YFLogxK
U2 - 10.1557/proc-391-283
DO - 10.1557/proc-391-283
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AN - SCOPUS:0029509640
SN - 0272-9172
VL - 391
SP - 283
EP - 288
JO - Materials Research Society Symposium - Proceedings
JF - Materials Research Society Symposium - Proceedings
Y2 - 17 April 1995 through 21 April 1995
ER -