TY - JOUR
T1 - Exoelectron emission studies of trap spectrum in ultrathin amorphous Si3N4 films
AU - Naich, M.
AU - Rosenman, G.
AU - Roizin, Ya
AU - Molotskii, M.
N1 - Funding Information:
This work was supported by the “MAGNET” program of the Chief Scientist Office at the Israeli Ministry of Industry and Trade, Consortium of Emerging Dielectrics and Conductor Technologies for the Semiconductor Industry.
PY - 2004/3
Y1 - 2004/3
N2 - We applied thermally stimulated exoelectron emission (TSEE) and thermally stimulated luminescence (TSL) methods for trap spectroscopy studies of ultrathin amorphous Si3N4 films used in ONO (oxide/nitride/oxide) structure-based microFlash memory devices. The temperature spectra of TSEE of the films demonstrate two groups of TSEE peaks: three low temperature peaks (T1=383 K, T2=393 K, T 3=413 K) and a high temperature maximum at T4=813 K. The developed Auger model of TSEE allowed calculating trap energy spectrum responsible for the TSEE peaks generation. TSEE results are shown to be consistent with trap energy activation Φ estimates obtained from microFLASH® two bit per cell memory transistor measurements where electrons stored at deep traps are responsible for high temperature TSEE peak with Φ4=1.73 eV. We believe that deep traps in silicon nitride are hydrogen containing centers. TSEE studies of the high temperature decay process of these traps explain excellent retention properties of microFlash memory devices.
AB - We applied thermally stimulated exoelectron emission (TSEE) and thermally stimulated luminescence (TSL) methods for trap spectroscopy studies of ultrathin amorphous Si3N4 films used in ONO (oxide/nitride/oxide) structure-based microFlash memory devices. The temperature spectra of TSEE of the films demonstrate two groups of TSEE peaks: three low temperature peaks (T1=383 K, T2=393 K, T 3=413 K) and a high temperature maximum at T4=813 K. The developed Auger model of TSEE allowed calculating trap energy spectrum responsible for the TSEE peaks generation. TSEE results are shown to be consistent with trap energy activation Φ estimates obtained from microFLASH® two bit per cell memory transistor measurements where electrons stored at deep traps are responsible for high temperature TSEE peak with Φ4=1.73 eV. We believe that deep traps in silicon nitride are hydrogen containing centers. TSEE studies of the high temperature decay process of these traps explain excellent retention properties of microFlash memory devices.
UR - http://www.scopus.com/inward/record.url?scp=0344552766&partnerID=8YFLogxK
U2 - 10.1016/j.sse.2003.08.008
DO - 10.1016/j.sse.2003.08.008
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AN - SCOPUS:0344552766
SN - 0038-1101
VL - 48
SP - 477
EP - 482
JO - Solid-State Electronics
JF - Solid-State Electronics
IS - 3
ER -