Examination of out-of-plane deformation in three-dimensional interface crack problems

Natalie Konovalov*, Leslie Banks-Sills

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

Interface behavior between two joined materials is of great importance for technological applications. Many engineering applications require one material to be bonded to another. Examples include adhesive joints, protective coatings, composite materials, and thin films used in the manufacture of microelectronic circuits. In all of these applications, techniques are required to predict the strength of the bond. It may be noted that cracks often develop at the interface between two materials or near it. In this study, a comparison was conducted between a two-dimensional criterion, that was obtained previously, and a three-dimensional criterion for the glass/epoxy pair studied.

Original languageEnglish
Title of host publicationTechnion Israel Institute of Technology - 48th Israel Annual Conference on Aerospace Sciences 2008
Pages737-746
Number of pages10
StatePublished - 2008
Event48th Israel Annual Conference on Aerospace Sciences 2008 - Tel-Aviv and Haifa, Israel
Duration: 27 Feb 200828 Feb 2008

Publication series

NameTechnion Israel Institute of Technology - 48th Israel Annual Conference on Aerospace Sciences 2008
Volume2

Conference

Conference48th Israel Annual Conference on Aerospace Sciences 2008
Country/TerritoryIsrael
CityTel-Aviv and Haifa
Period27/02/0828/02/08

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