TY - GEN
T1 - Examination of out-of-plane deformation in three-dimensional interface crack problems
AU - Konovalov, Natalie
AU - Banks-Sills, Leslie
PY - 2008
Y1 - 2008
N2 - Interface behavior between two joined materials is of great importance for technological applications. Many engineering applications require one material to be bonded to another. Examples include adhesive joints, protective coatings, composite materials, and thin films used in the manufacture of microelectronic circuits. In all of these applications, techniques are required to predict the strength of the bond. It may be noted that cracks often develop at the interface between two materials or near it. In this study, a comparison was conducted between a two-dimensional criterion, that was obtained previously, and a three-dimensional criterion for the glass/epoxy pair studied.
AB - Interface behavior between two joined materials is of great importance for technological applications. Many engineering applications require one material to be bonded to another. Examples include adhesive joints, protective coatings, composite materials, and thin films used in the manufacture of microelectronic circuits. In all of these applications, techniques are required to predict the strength of the bond. It may be noted that cracks often develop at the interface between two materials or near it. In this study, a comparison was conducted between a two-dimensional criterion, that was obtained previously, and a three-dimensional criterion for the glass/epoxy pair studied.
UR - http://www.scopus.com/inward/record.url?scp=84867081505&partnerID=8YFLogxK
M3 - פרסום בספר כנס
AN - SCOPUS:84867081505
SN - 9781605601274
T3 - Technion Israel Institute of Technology - 48th Israel Annual Conference on Aerospace Sciences 2008
SP - 737
EP - 746
BT - Technion Israel Institute of Technology - 48th Israel Annual Conference on Aerospace Sciences 2008
Y2 - 27 February 2008 through 28 February 2008
ER -