Interface behavior between two joined materials is of great importance for technological applications. Many engineering applications require one material to be bonded to another. Examples include adhesive joints, protective coatings, composite materials, and thin films used in the manufacture of microelectronic circuits. In all of these applications, techniques are required to predict the strength of the bond. It may be noted that cracks often develop at the interface between two materials or near it. In this study, a comparison was conducted between a two-dimensional criterion, that was obtained previously, and a three-dimensional criterion for the glass/epoxy pair studied.