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Enhanced gate induced drain leakage current in HfO2 MOSFETs

  • Moshe Gurfinkel*
  • , John S. Suehle
  • , Yoram Shapira
  • *Corresponding author for this work
  • Tel Aviv University
  • National Institute of Standards and Technology

Research output: Contribution to journalArticlepeer-review

10 Scopus citations

Abstract

The substrate current of high-κ dielectric MOSFETs has been studied using dc sweep and transient (down to 100 μs per I-V curve) electrical measurements. These measurements reveal trap-assisted substrate current components in addition to the traditional bell-shaped impact ionization current. By separating the transversal and lateral electric field contributions, the gate induced drain leakage (GIDL) is shown to dominate the substrate current at low gate biases. At high gate biases, tunneling of valence band electrons from the bulk to the gate dominates. The results show that the GIDL current is the result of band-to-band tunneling assisted by traps located at the HfO2/SiO2 interface and transition layer, and not the result of oxide charging.

Original languageEnglish
Pages (from-to)2157-2160
Number of pages4
JournalMicroelectronic Engineering
Volume86
Issue number11
DOIs
StatePublished - Nov 2009

Funding

Funders
NIST Office of Microelectronics Programs

    Keywords

    • Gate Induced Drain Leakage (GIDL)
    • High-κ Dielectrics
    • Substrate current

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