Electroplating of nickel-tungsten barrier layers

O. Younes, Y. Diamand-Shacham, E. Gileadi

Research output: Contribution to journalConference articlepeer-review

Abstract

The properties of electrodeposited Ni/W alloys are discussed. Alloys ranging in W content from zero up to 50 a/o have been prepared and their crystal structures were determined. Amorphous alloys are consistently obtained in the range of 20 - 40 a/o of W. These alloys are good potential candidates for barrier-layer film formation in ULSI devices, separating the silicon substrate from the copper. The complex nature of the solution chemistry that plays a crucial role in the formation of the alloy is discussed. High W content in the alloy is obtained if ammonia is eliminated from the solution. Hydrogen evolution is observed as a side reaction. The W content of the alloy drops sharply as the pH is changed from 8 to 9. Local increase in pH may occur in restricted areas, having high-aspect-ratios.

Original languageEnglish
Pages (from-to)337-342
Number of pages6
JournalAdvanced Metallization Conference (AMC)
StatePublished - 2000
EventAdvanced Metallization Conference 2000 - San Diego, CA, United States
Duration: 2 Oct 20004 Oct 2000

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