Abstract
The properties of electrodeposited Ni/W alloys are discussed. Alloys ranging in W content from zero up to 50 a/o have been prepared and their crystal structures were determined. Amorphous alloys are consistently obtained in the range of 20 - 40 a/o of W. These alloys are good potential candidates for barrier-layer film formation in ULSI devices, separating the silicon substrate from the copper. The complex nature of the solution chemistry that plays a crucial role in the formation of the alloy is discussed. High W content in the alloy is obtained if ammonia is eliminated from the solution. Hydrogen evolution is observed as a side reaction. The W content of the alloy drops sharply as the pH is changed from 8 to 9. Local increase in pH may occur in restricted areas, having high-aspect-ratios.
Original language | English |
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Pages (from-to) | 337-342 |
Number of pages | 6 |
Journal | Advanced Metallization Conference (AMC) |
State | Published - 2000 |
Event | Advanced Metallization Conference 2000 - San Diego, CA, United States Duration: 2 Oct 2000 → 4 Oct 2000 |