Electromigration-induced surface evolution in bamboo lines with transgranular and intergranular edge voids

Menachem Nathan*, Amir Averbuch, Moshe Israeli

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

The evolution of a surface intersected by transgranular (TG) and intergranular (IG) edge voids under isotropic surface diffusion and electric field effects is simulated numerically under both mass-conserving and non-mass-conserving boundary conditions. A surprising similarity is found in the surface topology of transgranular voids between our non-mass-conserving model and Schimschak and Krug's [J. Appl. Phys. 87 (2000) 695] mass-conserving model. The electric field is found to slow the development of an intergranular groove along a positively tilted grain boundary (GB), and to cause thinning or thickening of grains under non-mass-conserving conditions.

Original languageEnglish
Pages (from-to)347-350
Number of pages4
JournalThin Solid Films
Volume466
Issue number1-2
DOIs
StatePublished - 1 Nov 2004

Keywords

  • Electromigration
  • Modeling
  • Simulation
  • Surface evolution

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